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Immediate Release
Liantec Systems Corporation announces the Tiny-Bus(TM) modular expansion solution asthe standard embedded system integration solution. The Tiny-Bus(TM) is integratedwith 16xPCI-Express Graphics, AGP, PCI-Express and PCI bus interfaces on the 2.920 x3.600 inches of daughterboard. With the Tiny-Bus(TM) modular expansion solution, thesystem integrators can build their niche platform systems with special interfacemodules easily, quickly and cost effectively.
Multiple Bus Interface Expansibility
The Tiny-Bus(TM) modular expansion solution is integrated with the popular businterface including the 16xPCI-Express Graphics (PCI-EG), AGP, PCI-Express (PCI-E)and PCI in four board-to-board connectors. For the different applications, thesystem integrators can choose the interface module for their niche computingplatform including 16xPCI-EG based NVIDIA MXM mobile graphics module, Intel SDVO1080i HDTV module, 4xPCI-E SATA RAID module, PCI-E Gigabit Ethernet module, PCI-EExpressCard module, AGP-based VGA module, Intel DVI, VIA DVP, SiS VB based graphicsexpansion module, PCI-based PCMCIA, video capture, switch hub, multiple Ethernet andmini-PCI modules, and other 16xPCI-EG, AGP, PCI-E, PCI-based customized modules.
Flexible Modular Expansion Solution for Software Builders and System Integrators
For the software builders and system integrators, the Tiny-Bus(TM) modular expansionsolution can be help them to build the different platform for different applicationeasily, quickly and cost effectively. With the Tiny-Bus(TM) modular expansionsolution, the system integrators can build their systems with the same motherboardand different interface modules for different application, or use the same interfacemodule on different motherboard to separate the marketing position with differentCPU platform.
Space-saving Integration for Compact and Slim-type Embedded Systems
With the Tiny-Bus(TM) modular expansion solution, the system integration can be donewith the embedded interface modules at the same size as the motherboard. Thisfeature of Tiny-Bus(TM) modular expansion solution bring the benefit of space-savingfor the system integrators who need the smallest, compact and slim-type systemenclosure for the space-limited embedded computing application.
Quick, Reliable and Low Cost Customized ODM Service with Modular Solution
To meet the demand of customized ODM/OEM service, the Tiny-Bus(TM) modular expansionsolution makes it possible to build the customized niche platform based on theexisting motherboard and a new customized interface module. With the samemotherboard, the technical risk, lead time and NRE cost of customized ODM solutionis under control within the customized interface module rather than a total newmotherboard.
For the further information about Tiny-Bus(TM) modular expansion solution, pleasevisit the website at http://www.liantec.com/product /TBM.htm.
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